Saturday, July 31, 2021

Atomic Layer Deposition of copper - If you like sputtering, you'll love this!

 



An explanation and demo of atomic layer deposition (ALD) of copper metal on glass.  Precursors are copper(I) chloride and hydrogen, processed in a hot-wall tube quartz tube furnace.


10 torr operating pressure

500 sccm argon sweep/purge gas constantly flowing

75 sccm CuCl argon pulse gas (17 seconds including flow controller lag)

100 sccm H pulse gas (14 seconds including flow controller lag)

7 second purge time between pulses

100mm quartz tube furnace diameter 

415*C deposition temperature

350*C CuCl evaporation temperature

Substrates are mostly borosilicate glass cleaned with RCA clean

The "good" samples shown in the video are about 750 cycles (about 9 hours


Main ref:

https://sci-hub.se/https://doi.org/10.1002/cvde.19970030107

Also helpful:

https://sci-hub.se/https://doi.org/10.1063/1.5087759

https://sci-hub.se/10.1149/2.0261501jss

https://sci-hub.se/https://doi.org/10.1016/0022-0248(92)90191-K


Alicat flow controller manuals (hard to find via website navigation):

https://documents.alicat.com/manuals/DOC-MANUAL-MC.pdf

https://documents.alicat.com/manuals/old/Gas_Flow_Controller_Manual_rev7.pdf

https://documents.alicat.com/Alicat-Serial-Primer.pdf


RCA clean: https://en.wikipedia.org/wiki/RCA_clean


CuCl synthesis: http://wwwchem.uwimona.edu.jm/lab_manuals/c1901exp35.html


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2 comments:

  1. Try to deposit a zinc|copper hydroxide bilayer.
    Apply e- excitation!

    ReplyDelete
  2. This comment has been removed by the author.

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